嵌入式 - 片上系统（SoC） - Hengshenxin Electronics

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4 产品

型号	数量		库存	制造商	描述	Series	Part Status	Packaging	Operating Temperature	Package / Case	Supplier Device Package	Peripherals	Primary Attributes	Core Processor	Speed	Architecture	Flash Size	RAM Size	Connectivity
A2F200M3F-1FG256I	获得报价	PDF RFQ	2,255 有现货	Microsemi Corporation	IC FPGA 200K GATES 256KB 256-BGA	SmartFusion®	Discontinued at Digi-Key	Tray	-40°C ~ 100°C (TJ)	256-LBGA	256-FPBGA (17x17)	DMA, POR, WDT	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	ARM® Cortex®-M3	100MHz	MCU, FPGA	256Kb	64kb	EBI/EMI, Ethernet, I²C, SPI, UART/USART
A2F200M3F-1FG256	获得报价	PDF RFQ	3,272 有现货	Microsemi Corporation	IC FPGA 200K GATES 256KB 256-BGA	SmartFusion®	Discontinued at Digi-Key	Tray	0°C ~ 85°C (TJ)	256-LBGA	256-FPBGA (17x17)	DMA, POR, WDT	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	ARM® Cortex®-M3	100MHz	MCU, FPGA	256Kb	64kb	EBI/EMI, Ethernet, I²C, SPI, UART/USART
A2F200M3F-FG256I	获得报价	PDF RFQ	1,620 有现货	Microsemi Corporation	IC FPGA 200K GATES 256KB 256-BGA	SmartFusion®	Discontinued at Digi-Key	Tray	-40°C ~ 100°C (TJ)	256-LBGA	256-FPBGA (17x17)	DMA, POR, WDT	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	ARM® Cortex®-M3	80MHz	MCU, FPGA	256Kb	64kb	EBI/EMI, Ethernet, I²C, SPI, UART/USART
A2F200M3F-FG256	获得报价	PDF RFQ	3,728 有现货	Microsemi Corporation	IC FPGA 200K GATES 256KB 256-BGA	SmartFusion®	Discontinued at Digi-Key	Tray	0°C ~ 85°C (TJ)	256-LBGA	256-FPBGA (17x17)	DMA, POR, WDT	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	ARM® Cortex®-M3	80MHz	MCU, FPGA	256Kb	64kb	EBI/EMI, Ethernet, I²C, SPI, UART/USART

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