嵌入式 - 片上系统（SoC） - Hengshenxin Electronics

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7 产品

型号	价格		库存	制造商	描述	Series	Part Status	Packaging	Operating Temperature	Package / Case	Supplier Device Package	Peripherals	Primary Attributes	Core Processor	Speed	Architecture	Flash Size	RAM Size	Connectivity
XCZU11EG-3FFVC1760E	单位 $6,889.96	PDF RFQ	3,421 有现货	Xilinx Inc.	IC FPGA 512 I/O 1760FCBGA	Zynq® UltraScale+™ MPSoC EG	Active	Tray	0°C ~ 100°C (TJ)	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	DMA, WDT	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	600MHz, 1.5GHz	MCU, FPGA	-	256Kb	CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XCZU11EG-L2FFVC1760E	单位 $5,653.44	PDF RFQ	3,308 有现货	Xilinx Inc.	IC FPGA 512 I/O 1760FCBGA	Zynq® UltraScale+™ MPSoC EG	Active	Tray	0°C ~ 100°C (TJ)	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	DMA, WDT	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	600MHz, 1.5GHz	MCU, FPGA	-	256Kb	CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XCZU11EG-2FFVC1760I	单位 $5,653.44	PDF RFQ	602 有现货	Xilinx Inc.	IC FPGA 512 I/O 1760FCBGA	Zynq® UltraScale+™ MPSoC EG	Active	Tray	-40°C ~ 100°C (TJ)	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	DMA, WDT	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	600MHz, 1.5GHz	MCU, FPGA	-	256Kb	CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XCZU11EG-L1FFVC1760I	单位 $4,947.18	PDF RFQ	1,710 有现货	Xilinx Inc.	IC FPGA 512 I/O 1760FCBGA	Zynq® UltraScale+™ MPSoC EG	Active	Tray	-40°C ~ 100°C (TJ)	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	DMA, WDT	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	600MHz, 1.5GHz	MCU, FPGA	-	256Kb	CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XCZU11EG-2FFVC1760E	单位 $4,947.18	PDF RFQ	2,590 有现货	Xilinx Inc.	IC FPGA 512 I/O 1760FCBGA	Zynq® UltraScale+™ MPSoC EG	Active	Tray	0°C ~ 100°C (TJ)	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	DMA, WDT	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	600MHz, 1.5GHz	MCU, FPGA	-	256Kb	CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XCZU11EG-1FFVC1760I	单位 $4,416.93	PDF RFQ	1,666 有现货	Xilinx Inc.	IC FPGA 512 I/O 1760FCBGA	Zynq® UltraScale+™ MPSoC EG	Active	Tray	-40°C ~ 100°C (TJ)	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	DMA, WDT	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	600MHz, 1.5GHz	MCU, FPGA	-	256Kb	CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
XCZU11EG-1FFVC1760E	单位 $3,533.54	PDF RFQ	1,013 有现货	Xilinx Inc.	IC FPGA 512 I/O 1760FCBGA	Zynq® UltraScale+™ MPSoC EG	Active	Tray	0°C ~ 100°C (TJ)	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	DMA, WDT	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	600MHz, 1.5GHz	MCU, FPGA	-	256Kb	CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

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